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High-bandwidth memory (HBM) is mostly reserved for the most AI-forward hardware from AMD or NVIDIA. However, it is coming to devices that can fit into the palm of the user’s hand soon, according to the latest rumors. 

Currently, the world’s highest-end smartphones have RAM based on low-power DDR5X (or LPDDR5X) for its speed and efficiency. Even its potential for ~68 gigabyte per second (GB/s) performance might not be enough soon, which might drive manufacturers to make a significant upgrade.

The alleged next step forward in mobile device RAM technology may be necessary to keep up with the demands of ever more powerful artificial intelligence (AI) in the near future.

Then again, the typically knowledgeable leaker Fixed Focus Digital asserts that smartphone HBM (or ‘mobile HBM’) will not be true up-to-~2TB/s bandwidth memory at all, but more like the new kind of low-latency wide I/O DRAM (or LLW DRAM) also recently developed to support AI functionality.

It is touted to achieve next-gen processing speeds of up to 128GB/s in its current form nonetheless. 

In terms of first-mover ‘HBM smartphone’ makers, Apple and its iPhones might be a prime candidate. The Cupertino giant is thought to be beaten to the punch by another, however.

That company might be Huawei – although, as a maker of HBM and LLW RAM itself, Samsung is also well-positioned to become a pioneer in making this supposed upgrade.

Deirdre O Donnell – Senior Tech Writer – 8491 articles published on Notebookcheck since 2018

I became a professional writer and editor shortly after graduation. My degrees are in biomedical sciences; however, they led to some experience in the biotech area, which convinced me of its potential to revolutionize our health, environment and lives in general. This developed into an all-consuming interest in more aspects of tech over time: I can never write enough on the latest electronics, gadgets and innovations. My other interests include imaging, astronomy, and streaming all the things. Oh, and coffee.

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